1. Features a tough, wear-resistant coating, capable of withstanding repeated scratches, abrasions, and soldering without damage. 2. Clear layout and reasonable structure, facilitating the learning of basic skills such as stencil printing, chip mounting, connector assembly/disassembly, BGA rework, and soldering/desoldering. 3. Equipped with various component packages and pad layouts, supporting multiple training exercises. 4. Supports various BGA sizes, such as BGA153, BGA162, BGA169, BGA178, BGA200, BGA221, BGA254, BGA297, and BGA315. 5. Supports connector assembly/disassembly exercises, including pads for NFC, baseband chips, Wi-Fi modules, etc. 6. Stencil printing exercises, ideal for mastering the techniques of applying solder paste using a stencil.
