1. Used to locate and relocate mobile phone PCB BGA parts 2. Convenient and quick re-bombardment of BGA without causing any damage, suitable for iPhone 11/11 Pro / 11 Pro Max BGA repositioning and repair to provide solutions 3. Unique hole design makes it easier to take out the formed solder balls 4. Fast and convenient soldering 5. Size: about 13x9x1.7cm
