1. A variety of models meet the needs of different scenarios for mobile phone repair 2. Ma1.0: pry to remove the glue from IC and CPU 3. Ma2.0: corner knife scraping IC peripheral glue 4. Ma3.0: special-shaped rubber tapping knife, cut vinyl without hurting the board 5. Ma4.0: prying IC hard disk 6. Ma5.0: prying CPU IC hard disk and CPU layering 7. Package includes: 2 x Knife Handle 5 x Blades
